Yah Wen is a Senior BIOS & Bootloader Lead Engineer from the Internet of Things Group (IoTG) in Intel Corporation. He has 15 years' experience in BIOS, UEFI & bootloader development mainly in computer mobile & desktop boards, industrial PXIe controllers as well as other embedded systems. He is from Penang, Malaysia.
The Slim Bootloader was launched publicly in OSFC2018. Since then, it has attracted public interest and gaining momentum in adoption from the open-source community. The team at Intel continues to make improvements, enhancements & new features to Slim Bootloader over the year and this presentation will provide a summary of what has changed and the key learnings we’ve obtained. This session will also share on the future plans for Slim Bootloader and what’s to be expected.
Slim Bootloader is an open-source boot solution designed for Internet of Things use cases that requires fast boot speed, built-in security and extensible configuration running on Intel x86 architecture. It leverages the Intel FSP as well as libraries from the EDK2 framework to perform board level configuration and SoC initialization. By default it comes out of the box with an OSLoader payload to perform Linux boot logic as well as a firmware update capable payload to perform the updates in securely and safely methodology. This presentation will walk you through the steps required to port Slim Bootloader for your mainboard with supported Intel SoC using Intel FSP and booting an operating system in both secure and non-secure settings.